- Location
- Albany, United States · Onsite
- Compensation
- Not stated in this snapshot
- Employment
- Not stated
- Experience level
- ENTRY (0–2 years exp)
- Specialization
- Hardware Engineer, Development
- Source
- IBM
Role Overview
Job opportunity for Silicon Technology Research and Development Hardware Engineering Intern 2027 at IBM.
Role Overview
IBM Research is seeking intern candidates who want to apply their classroom learnings to real world challenges. As a Hardware Engineer Intern in semiconductor research, you will work with world-class global researchers focused on enabling next-generation chips and systems that support the tremendous processing power and unprecedented speeds required for next generation logic/memory technology and support applications such as quantum silicon and artificial intelligence.
In this role, you will investigate the feasibility of applying science and engineering principles towards innovative, new hardware design and applications from state-of-the-art chip architecture, design, fabrication and test to advanced chip packaging. Background knowledge of engineering disciplines, computer science, physics, or materials science are ideal skills for this role. Interns are expected to have the ability to analyze complex problems and apply creative solutions to groundbreaking hardware engineering projects.
Electrical engineering/Mechanical Engineering/Computer Science/Materials Engineering/Physics/Chemistry
Semiconductor fabrication knowledge and/or coursework.
Responsibilities & Requirements
Please refer to the role details above for responsibilities, requirements, and required skills.
Application Instructions
Apply directly on IBM Careers at Silicon Technology Research and Development Hardware Engineering Intern 2027.